ZedLabz
APU GPU BGA reballing Stencil set for Nintendo Wii rework template replacement - 4 peice | ZedLabz
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Features:
- Direct heat rework template for Nintendo Wii GPU CPU BGA.
- Includes 4 pieces.
- For 0.6 solder balls (0.50mm for CPU).
- Recommended for use by experienced engineers only.
Description:
A stencil template for the Nintendo Wii console GPU CPU BGA allows the precise reballing of the chip for rework jobs, ideal for fixing various motherboard faults.
Same working day dispatch when ordered before 4pm.
- Direct heat rework template for Nintendo Wii GPU CPU BGA.
- Includes 4 pieces.
- For 0.6 solder balls (0.50mm for CPU).
- Recommended for use by experienced engineers only.
Description:
A stencil template for the Nintendo Wii console GPU CPU BGA allows the precise reballing of the chip for rework jobs, ideal for fixing various motherboard faults.
Same working day dispatch when ordered before 4pm.
Platform | Nintendo Wii |
---|---|
Colour | Silver |
Manufacturer | ZedLabz |
EAN | 5056026434393 |
SKU | 700514 |
Weight | 15g |